《DFMA面向制造与装配的设计》英文版 第5-6部分（76页）

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  《DFMA面向制造与装配的设计》英文版 第5-6部分（76页）

  在产品设计阶段，充分考虑来自于产品制造和装配的要求，使得机械工程师设计的产品具有很好的可制造性和可装配性，从根本上避免在产品开发后期出现的制造和装配质量问题。

  本附件包含以下内容：

  Product Design for Manufacture and Assembly（Third Edition）

  5. Design for High-Speed Automatic Assembly and Robot Assembly........................ 185

  5.1 Introduction..... 185

  5.2 Design of Parts for High-Speed Feeding and Orienting............ 186

  5.3 Example........... 189

  5.4 Additional Feeding Difficulties......................... 193

  5.5 High-Speed Automatic Insertion....................... 193

  5.6 Example........... 197

  5.7 Analysis of an Assembly........... 198

  5.8 General Rules for Product Design for Automation..................... 198

  5.9 Design of Parts for Feeding and Orienting......203

  5.10 Summary of Design Rules for High-Speed Automatic Assembly......................206

  5.10.1 Rules for Product Design.......................206

  5.10.2 Rules for the Design of Parts.................206

  5.11 Product Design for Robot Assembly.................206

  5.11.1 Summary of Design Rules for Robot Assembly............. 212

  References.................. 218

  6. Printed Circuit Board Design for Manufacture and Assembly....... 219

  6.1 Introduction..... 219

  6.2 Design Sequence for Printed Circuit Boards.... 219

  6.3 Types of Printed Circuit Boards.........................220

  6.3.1 Number of Sides............220

  6.3.2 Number of Layers......... 221

  6.3.3 Board Materials............. 221

  6.3.4 Device Types..................222

  6.3.5 Copper Weight..............222

  6.4 Bare Board Manufacture...........222

  6.4.1 Basic Bare Board Costs...........................223

  6.4.2 Number of Boards per Panel.................225

  6.4.3 Hole Drilling..................226

  6.4.4 Optional Bare Board Processes.............226

  6.4.5 Bare Board Testing........227

  6.5 Terminology.....227

  6.6 Assembly of Printed Circuit Boards.................228

  6.6.1 Assembly Operations for Through-Hole Printed Circuit Boards..........229

  6.6.1.1 Automatic Dual Inline Package Insertion.......230

  6.6.1.2 Automatic Axial (VCD) Insertion..................... 232

  6.6.1.3 Automatic Single Inline Package Insertion.....234

  6.6.1.4 Automatic Radial Component Insertion..........234

  6.6.1.5 Semiautomatic Insertion........235

  6.6.1.6 Manual Insertion.....................235

  6.6.1.7 Robot Insertion........................236

  6.6.1.8 Inspection and Rework...........236

  6.6.2 Assembly of Surface-Mounted Devices....236

  6.6.3 Soldering Processes......238

  6.6.3.1 Wave Soldering........................238

  6.6.3.2 Reflow Soldering.....................238

  6.6.4 Other Assembly Processes.................... 239

  6.6.4.1 Cleaning.......... 239

  6.6.4.2 Rework............ 239

  6.6.4.3 Board Testing........................... 240

  6.6.5 Assembly Sequences for Printed Circuit Boards........... 240

  6.7 Estimation of PCB Assembly Costs................... 242

  6.7.1 Component Insertion Costs................... 243

  6.7.1.1 Insertion Cost........................... 244

  6.7.1.2 Setup Cost...... 246

  6.7.1.3 Rework Cost............................. 247

  6.7.1.4 Programming Cost.................. 247

  6.7.2 Worksheet for Printed Circuit Board Assembly Costs............................ 248

  6.7.3 Example.... 248

  6.8 Case Studies in PCB Assembly..........................250

  6.8.1 Measuring Instrument Connector Board........................250

  6.8.2 Power Supply.................254

  6.9 Glossary of Terms......................256

   

  References..................260

• 资料大小：
  4721.93KB
• 所属类别：
  科研开发
• 更新日期：
  2020-01-02
• 适用行业：
  电子电气；机械设备与装置；特种设备；机动车；医疗器械；计量与测量
• 上传人：
  NJKY
• 标 签：

  DFMA 面向制造与装配的设计

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